{"id":453664,"date":"2024-10-20T09:31:30","date_gmt":"2024-10-20T09:31:30","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-iec-62047-432024\/"},"modified":"2024-10-26T17:40:08","modified_gmt":"2024-10-26T17:40:08","slug":"bs-iec-62047-432024","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-iec-62047-432024\/","title":{"rendered":"BS IEC 62047-43:2024"},"content":{"rendered":"

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
4<\/td>\nCONTENTS <\/td>\n<\/tr>\n
5<\/td>\nFOREWORD <\/td>\n<\/tr>\n
7<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
8<\/td>\n1 Scope
2 Normative references
3 Terms and definitions <\/td>\n<\/tr>\n
9<\/td>\n4 Test piece
4.1 General
4.2 Shape of a test piece
Figures
Figure 1 \u2013 Schematic explanation of cyclic bending test <\/td>\n<\/tr>\n
10<\/td>\nFigure 2 \u2013 Schematic illustration of flexible MEMS test piece <\/td>\n<\/tr>\n
11<\/td>\n5 Test method
5.1 Principle
Figure 3 \u2013 Selection of bending axis <\/td>\n<\/tr>\n
12<\/td>\n5.2 Test apparatus and instrumentation
5.2.1 Test apparatus
5.2.2 Instrumentation
Figure 4 \u2013 Folding procedures <\/td>\n<\/tr>\n
13<\/td>\n5.3 Procedure
5.3.1 Testing conditions
5.3.2 Selection of bending direction <\/td>\n<\/tr>\n
14<\/td>\n5.3.3 Determination of bending axes
5.3.4 Measurement of test piece dimensions
5.3.5 Measurement of folding distance
5.3.6 Number of testing <\/td>\n<\/tr>\n
15<\/td>\n5.3.7 Instrumentation
5.3.8 End of testing
6 Test report
6.1 General
6.2 Bending direction(s) and in-plane locations of bending axes
6.3 Dimensions of the test piece <\/td>\n<\/tr>\n
16<\/td>\n6.4 Performance degradation characteristics with the folding distance
6.5 Testing conditions
Figure 5 \u2013 3-dimensional P-S-N plot <\/td>\n<\/tr>\n
18<\/td>\nAnnex A (informative)Example of P-S-N plot of flexible MEMS device <\/td>\n<\/tr>\n
19<\/td>\nFigure A.1 \u2013 Test piece \u2013 Printed wiring on paper substrate
Figure A.2 \u2013 Test apparatus <\/td>\n<\/tr>\n
20<\/td>\nFigure A.3 \u2013 3-dimensional P-S-N plot
Figure A.4 \u2013 2-dimensional P-S-N plot <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Semiconductor devices. Micro-electromechanical devices – Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2024<\/td>\n22<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":453674,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[577,2641],"product_tag":[],"class_list":{"0":"post-453664","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-080-99","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/453664","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/453674"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=453664"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=453664"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=453664"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}