IEC 62228-5:2021(E) specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems <\/p>\n
and covers <\/p>\n
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| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 3.2 Abbreviated terms <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 4 General Tables Table 1 \u2013 Overview of measurements and tests <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 5 Test and operating conditions 5.1 Supply and ambient conditions 5.2 Test operation modes 5.2.1 General Table 2 \u2013 Supply and ambient conditions for functional operation <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | 5.2.2 Transceiver configuration for normal operation mode 5.2.3 Transceiver configuration for low power mode 5.3 Definition of BIN Table 3 \u2013 Definition for transceiver configuration for normal operation mode Table 4 \u2013 Definition for transceiver mode configuration for low power mode <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | 5.4 Test configuration 5.4.1 General configuration for transceiver network Figures Figure 1 \u2013 Minimum MDI interface test network (Min-BIN) Figure 2 \u2013 Standard MDI interface test network (Std-BIN) Figure 3 \u2013 Optimized MDI interface test network (Opt-BIN) <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | Figure 4 \u2013 General test configuration for testsin transceiver network for conducted tests <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | 5.4.2 General configuration for single transceiver 5.4.3 Transceiver network tests \u2013 coupling ports and networks for conducted tests Figure 5 \u2013 General test configuration for unpowered ESD test Table 5 \u2013 Selection recommendation of MII interfacesfor transceiver network configuration <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | Figure 6 \u2013 Transceiver network tests \u2013 coupling ports and networks <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | Table 6 \u2013 Transceiver network tests \u2013 component value definitionsof coupling ports and networks <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | 5.4.4 Single transceiver tests \u2013 coupling ports and networks <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 5.5 Test communication and signals 5.5.1 General 5.5.2 Test signals for normal operation mode Figure 7 \u2013 Coupling ports and networks for unpowered ESD tests Table 7 \u2013 Definitions of coupling ports for unpowered ESD tests <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 5.5.3 Test signals for low power mode 5.6 Evaluation criteria 5.6.1 General 5.6.2 Evaluation criteria for functional operation modes Table 8 \u2013 Definition for transceiver mode configuration for normal operation mode <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 5.6.3 Evaluation criteria in unpowered condition after exposure to disturbances Table 9 \u2013 Evaluation criteria for Ethernet transceiver <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | 5.6.4 Status classes Figure 8 \u2013 Principle drawing of the maximum deviation on an IV characteristic Table 10 \u2013 Definition of functional status classes <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | 5.7 DUT specific information 6 Test and measurement 6.1 Emission of conducted RF disturbances 6.1.1 Test method 6.1.2 Test setup <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | 6.1.3 Test procedure and parameters Figure 9 \u2013 Test setup for measurement of conducted RF disturbances Table 11 \u2013 Settings of the conducted RF measurement equipment <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | 6.2 Immunity to conducted RF disturbances 6.2.1 Test method 6.2.2 Test setup Table 12 \u2013 Conducted emission measurements <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | 6.2.3 Test procedure and parameters Figure 10 \u2013 Test setup for DPI tests <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | Table 13 \u2013 Specifications for DPI tests <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | Table 14 \u2013 DPI tests for functional status class AIC evaluationof Ethernet transceivers <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | Table 15 \u2013 DPI tests for functional status class CIC or DIC evaluationof Ethernet transceivers <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | 6.3 Immunity to impulses 6.3.1 Test method 6.3.2 Test setup Figure 11 \u2013 Test setup for impulse immunity tests <\/td>\n<\/tr>\n | ||||||
| 39<\/td>\n | 6.3.3 Test procedure and parameters Table 16 \u2013 Specifications for impulse immunity tests Table 17 \u2013 Parameters for impulse immunity test <\/td>\n<\/tr>\n | ||||||
| 40<\/td>\n | Table 18 \u2013 Impulse immunity tests for functional status class AIC evaluationof Ethernet transceivers Table 19 \u2013 Impulse immunity tests for functional status class CIC or DIC evaluation of Ethernet transceivers <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | 6.4 Electrostatic Discharge (ESD) 6.4.1 Test method 6.4.2 Test setup Figure 12 \u2013 Test setup for powered ESD tests \u2013 principle arrangement <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | Figure 13 \u2013 Test setup for powered ESD tests \u2013 stimulation and monitoring <\/td>\n<\/tr>\n | ||||||
| 43<\/td>\n | Figure 14 \u2013 Test setup for unpowered ESD tests \u2013 principle arrangement <\/td>\n<\/tr>\n | ||||||
| 45<\/td>\n | Figure 15 \u2013 Test setup for unpowered ESD tests \u2013 stimulation and monitoring for function validation pre and post ESD test <\/td>\n<\/tr>\n | ||||||
| 46<\/td>\n | 6.4.3 Test procedure and parameters Table 20 \u2013 Specifications for ESD tests <\/td>\n<\/tr>\n | ||||||
| 47<\/td>\n | Table 21 \u2013 ESD tests in powered mode for functional status class AIC, CICand DIC evaluation of Ethernet transceivers <\/td>\n<\/tr>\n | ||||||
| 48<\/td>\n | 7 Test report Table 22 \u2013 ESD tests in unpowered mode for functional status class DIC evaluationof Ethernet transceiver ICs <\/td>\n<\/tr>\n | ||||||
| 49<\/td>\n | Annex A (normative)Ethernet test circuits A.1 General A.2 Test circuit for Ethernet transceivers for functional tests <\/td>\n<\/tr>\n | ||||||
| 50<\/td>\n | Figure A.1 \u2013 General drawing of the circuit diagram of test networkfor 100BASE-T1 and 1000BASE-T1 Ethernet transceivers for functionaltest using conducted test methods <\/td>\n<\/tr>\n | ||||||
| 51<\/td>\n | A.3 Test circuit for Ethernet transceivers for ESD test Figure A.2 \u2013 General drawing of the circuit diagram of test networkfor 100BASE-TX Ethernet transceivers for functional test using conducted test methods <\/td>\n<\/tr>\n | ||||||
| 52<\/td>\n | Figure A.3 \u2013 General drawing of the circuit diagram forESD tests of Ethernet transceivers in powered mode <\/td>\n<\/tr>\n | ||||||
| 53<\/td>\n | Figure A.4 \u2013 General drawing of the circuit diagram for ESD tests of Ethernet transceivers in unpowered mode <\/td>\n<\/tr>\n | ||||||
| 54<\/td>\n | Annex B (normative)Test circuit boards B.1 Test circuit board for transceiver network configuration Figure B.1 \u2013 Example of functional conducted test boardfor Ethernet transceiver ICs (100BASE-T1) <\/td>\n<\/tr>\n | ||||||
| 55<\/td>\n | Figure B.2 \u2013 Example of powered ESD test boardfor Ethernet transceivers ICs (100BASE-T1) <\/td>\n<\/tr>\n | ||||||
| 56<\/td>\n | B.2 Test circuit board for single transceiver configuration Figure B.3 \u2013 Example of unpowered ESD test boardfor Ethernet transceivers ICs (100BASE-T1), top layer Figure B.4 \u2013 Example of unpowered ESD test boardfor Ethernet transceivers ICs (100BASE-T1), bottom layer <\/td>\n<\/tr>\n | ||||||
| 57<\/td>\n | Table B.1 \u2013 Parameter ESD test circuit board <\/td>\n<\/tr>\n | ||||||
| 58<\/td>\n | Annex C (informative)Test of Ethernet transceiver for radiated RF emission and RF immunity C.1 General C.2 General configuration for transceiver network Figure C.1 \u2013 General test configuration for testsin transceiver network used for radiated tests <\/td>\n<\/tr>\n | ||||||
| 59<\/td>\n | C.3 Tests C.3.1 General <\/td>\n<\/tr>\n | ||||||
| 60<\/td>\n | Figure C.2 \u2013 General drawing of the circuit diagram of test network for 100BASE-T1 and 1000BASE-T1 Ethernet transceivers for functional test using radiated RF test methods <\/td>\n<\/tr>\n | ||||||
| 61<\/td>\n | Figure C.3 \u2013 Example of functional radiated test board for Ethernettransceiver ICs (100BASE-T1), top layer (DUT side) <\/td>\n<\/tr>\n | ||||||
| 62<\/td>\n | Figure C.4 \u2013 Example of functional radiated test board for Ethernettransceiver ICs (100BASE-T1), bottom layer (external circuitry side) <\/td>\n<\/tr>\n | ||||||
| 63<\/td>\n | C.3.2 Emission of radiated RF disturbances Figure C.5 \u2013 Test setup for measurement of radiated RF emission <\/td>\n<\/tr>\n | ||||||
| 64<\/td>\n | C.3.3 Immunity to radiated RF disturbances Table C.1 \u2013 Settings of the radiated RF measurement equipment Table C.2 \u2013 Radiated RF emission measurements <\/td>\n<\/tr>\n | ||||||
| 65<\/td>\n | Figure C.6 \u2013 Test setup for radiated RF immunity tests <\/td>\n<\/tr>\n | ||||||
| 66<\/td>\n | Table C.3 \u2013 Specifications for radiated RF immunity tests <\/td>\n<\/tr>\n | ||||||
| 67<\/td>\n | Table C.4 \u2013 Radiated RF immunity tests for functionalstatus class AIC evaluation of Ethernet transceivers <\/td>\n<\/tr>\n | ||||||
| 68<\/td>\n | Annex D (informative)Examples for test limits for Ethernet transceiverin automotive application D.1 General D.2 Emission of conducted RF disturbances Figure D.1 \u2013 Example of limits for conducted RF emission \u2013MDI Opt-BIN, VBAT and WAKE <\/td>\n<\/tr>\n | ||||||
| 69<\/td>\n | D.3 Immunity to conducted RF disturbances Figure D.2 \u2013 Example of limits for conducted RF emission \u2013 local supplies Table D.1 \u2013 Example of limits for conducted RF emission \u2013test cases with recommended limit classes <\/td>\n<\/tr>\n | ||||||
| 70<\/td>\n | Figure D.3 \u2013 Example of limits for conducted RF immunityfor functional status class AIC \u2013 MDI Opt-BIN Figure D.4 \u2013 Example of limits for conducted RF immunityfor functional status class AIC \u2013 VBAT and WAKE <\/td>\n<\/tr>\n | ||||||
| 71<\/td>\n | Table D.2 \u2013 Example of limits for conducted RF immunity \u2013test cases with recommended limit classes for functional status class AIC <\/td>\n<\/tr>\n | ||||||
| 72<\/td>\n | Figure D.5 \u2013 Example of limits for conducted RF immunityfor functional status class CIC or DIC \u2013 MDI Opt-BIN Figure D.6 \u2013 Example of limits for conducted RF immunityfor functional status class CIC or DIC \u2013 VBAT and WAKE <\/td>\n<\/tr>\n | ||||||
| 73<\/td>\n | D.4 Immunity to impulses D.5 Electrostatic discharge (ESD) Table D.3 \u2013 Example of limits for conducted RF immunity \u2013test cases with recommended limit classes for functional status class CIC or DIC Table D.4 \u2013 Example of limits for impulse immunity \u2013 Class I Table D.5 \u2013 Example of limits for impulse immunity \u2013test cases with recommended limit classes for functional status class CIC or DIC <\/td>\n<\/tr>\n | ||||||
| 74<\/td>\n | D.6 Emission of radiated RF disturbances Figure D.7 \u2013 Example of limits for radiated RF emissionfor IC stripline with 6,7 mm active conductor height Table D.6 \u2013 Example of limits for powered and unpowered ESD tests \u2013 test cases with recommended limits for functional status class A1IC, A2IC, A3IC, CIC or DIC <\/td>\n<\/tr>\n | ||||||
| 75<\/td>\n | D.7 Immunity to radiated RF disturbances Figure D.8 \u2013 Example of limits for radiated RF immunity Table D.7 \u2013 Example of limits for radiated RF emission \u2013test cases with recommended limit classes <\/td>\n<\/tr>\n | ||||||
| 76<\/td>\n | Table D.8 \u2013 Example of limits for radiated RF immunity \u2013test cases with recommended limit classes <\/td>\n<\/tr>\n | ||||||
| 77<\/td>\n | Annex E (informative)Characterization of common mode chokesfor EMC evaluation of Ethernet transceivers E.1 General E.2 Test E.2.1 General Figure E.1 \u2013 General electrical drawing of a CMC <\/td>\n<\/tr>\n | ||||||
| 78<\/td>\n | E.2.2 S-parameter measurement mixed mode Figure E.2 \u2013 Test setup for S-parameter measurements at CMC <\/td>\n<\/tr>\n | ||||||
| 79<\/td>\n | Figure E.3 \u2013 Example of test board 4-port S-parameter measurement at CMC \u2013mixed mode, top layer Figure E.4 \u2013 Example of test board 3-port S-parameter measurement at CMC \u2013single ended, top layer <\/td>\n<\/tr>\n | ||||||
| 80<\/td>\n | Table E.1 \u2013 Test procedure and parametersfor 3-port test board characterization for CMC <\/td>\n<\/tr>\n | ||||||
| 81<\/td>\n | Table E.2 \u2013 Test procedure and parameters for S-parameter measurements at CMC <\/td>\n<\/tr>\n | ||||||
| 82<\/td>\n | Figure E.5 \u2013 Recommended characteristics for Sdd11, Sdd22 (RL) for CMC Table E.3 \u2013 Required S-parameter measurements for CMC <\/td>\n<\/tr>\n | ||||||
| 83<\/td>\n | Figure E.6 \u2013 Recommended characteristics for Sdd21 (IL) for CMC Figure E.7 \u2013 Recommended characteristics for Scc21 (CMR) for CMC <\/td>\n<\/tr>\n | ||||||
| 84<\/td>\n | Figure E.8 \u2013 Recommended characteristics for Sdc11, Sdc22 (LCL) for CMC Figure E.9 \u2013 Recommended characteristics for Ssd21, Ssd12 (DCMR)and Sds21, Sds12 (CDMR) for CMC <\/td>\n<\/tr>\n | ||||||
| 85<\/td>\n | E.2.3 ESD damage Figure E.10 \u2013 Test setup for ESD damage tests at CMC <\/td>\n<\/tr>\n | ||||||
| 86<\/td>\n | Figure E.11 \u2013 Example of ESD test board for CMC, top layer Table E.4 \u2013 Test parameters for ESD damage tests at CMC <\/td>\n<\/tr>\n | ||||||
| 87<\/td>\n | E.2.4 Saturation test at RF disturbances Table E.5 \u2013 Required ESD tests for damage for CMC <\/td>\n<\/tr>\n | ||||||
| 88<\/td>\n | Figure E.12 \u2013 Test setup for RF saturation measurements at CMC Figure E.13 \u2013 Example of RF saturation \/ S-parameter test board for CMC, top layer <\/td>\n<\/tr>\n | ||||||
| 89<\/td>\n | Table E.6 \u2013 Test procedure and parameters for RF saturation tests at CMC Table E.7 \u2013 Required RF saturation tests for CMC <\/td>\n<\/tr>\n | ||||||
| 90<\/td>\n | E.2.5 Saturation test at ESD Figure E.14 \u2013 Test setup for ESD saturation measurements at CMC Figure E.15 \u2013 Example of ESD saturation test board for CMC, top layer <\/td>\n<\/tr>\n | ||||||
| 91<\/td>\n | Table E.8 \u2013 Test procedure and parameters for ESD saturation tests at CMC Table E.9 \u2013 Required ESD saturation tests for CMC Table E.10 \u2013 ESD saturation break down voltage classes for CMC <\/td>\n<\/tr>\n | ||||||
| 92<\/td>\n | E.2.6 TDR measurement of differential mode impedance Figure E.16 \u2013 Example of ESD saturation tests results for CMC Figure E.17 \u2013 Test setup for TDR measurement at CMC <\/td>\n<\/tr>\n | ||||||
| 93<\/td>\n | Figure E.18 \u2013 Example of TDR test board for CMC, top layer Table E.11 \u2013 Test procedure and parameters for TDR measurement at CMC Table E.12 \u2013 Required TDR measurements for CMC <\/td>\n<\/tr>\n | ||||||
| 94<\/td>\n | Annex F (informative)Characterization of ESD suppression devicesfor EMC evaluation of Ethernet transceivers F.1 General Table F.1 \u2013 Specification of ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 95<\/td>\n | F.2 Test F.2.1 General Figure F.1 \u2013 Arrangement of ESD suppression devicewithin the 100BASE-T1 and 1000BASE-T1 MDI interface <\/td>\n<\/tr>\n | ||||||
| 96<\/td>\n | F.2.2 S-parameter measurement mixed mode Figure F.2 \u2013 Test setup for S-parameter measurements at ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 97<\/td>\n | Figure F.3 \u2013 Example of test board 4-port S-parameter measurementfor ESD suppression device \u2013 mixed mode, top layer Figure F.4 \u2013 Example of test board 3-port S-parameter measurementfor ESD suppression device \u2013 single ended, top layer <\/td>\n<\/tr>\n | ||||||
| 98<\/td>\n | Table F.2 \u2013 Test procedure and parameters for 3-port test boardcharacterization for ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 99<\/td>\n | Table F.3 \u2013 Test procedure and parameters for S-parametermeasurements at ESD suppression device Table F.4 \u2013 Required S-parameter measurements for ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 100<\/td>\n | Figure F.5 \u2013 Recommended characteristics for Sdd11 (RL) for ESD suppression device Figure F.6 \u2013 Recommended characteristics for Sdd21 (IL) for ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 101<\/td>\n | Figure F.7 \u2013 Recommended characteristics for Ssd21 (DCMR)for ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 102<\/td>\n | F.2.3 ESD damage Figure F.8 \u2013 Test setup for ESD damage tests at ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 103<\/td>\n | Figure F.9 \u2013 Example of ESD test board for ESD suppression device, top layer <\/td>\n<\/tr>\n | ||||||
| 104<\/td>\n | Table F.5 \u2013 Test parameters for ESD damage tests at ESD suppression device Table F.6 \u2013 Required ESD tests for damage for ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 105<\/td>\n | F.2.4 ESD discharge current measurement Figure F.10 \u2013 Test setup for ESD discharge current measurementat ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 106<\/td>\n | Figure F.11 \u2013 Example of ESD discharge current test boardfor ESD suppression device, top and bottom layer <\/td>\n<\/tr>\n | ||||||
| 107<\/td>\n | Table F.7 \u2013 Test parameters for ESD discharge currentmeasurement at ESD suppression device Table F.8 \u2013 Required current measurement for ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 108<\/td>\n | Figure F.12 \u2013 Example of test results and recommended limits for remaining ESD discharge current after the MDI test network for ESD suppression device Table F.9 \u2013 Recommended limits for remaining ESD discharge currentafter the MDI test network for ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 109<\/td>\n | F.2.5 Test of unwanted clamping effect at RF immunity tests Figure F.13 \u2013 Test setup for RF clamping test at ESD suppression device Table F.10 \u2013 Limit classes and related applied ESD test voltages <\/td>\n<\/tr>\n | ||||||
| 110<\/td>\n | Figure F.14 \u2013 Example of test board RF clamping test at suppression device, top layer <\/td>\n<\/tr>\n | ||||||
| 111<\/td>\n | Table F.11 \u2013 Test procedure and parameters for RF clampingtests at ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 112<\/td>\n | Figure F.15 \u2013 Recommended test power levels for RF clampingtests at ESD suppression device Table F.12 \u2013 Required RF clamping tests for ESD suppression device <\/td>\n<\/tr>\n | ||||||
| 113<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Integrated circuits. EMC evaluation of transceivers – Ethernet transceivers<\/b><\/p>\n |