{"id":344030,"date":"2024-10-20T00:09:24","date_gmt":"2024-10-20T00:09:24","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-617092017\/"},"modified":"2024-10-25T23:29:53","modified_gmt":"2024-10-25T23:29:53","slug":"bs-en-617092017","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-617092017\/","title":{"rendered":"BS EN 61709:2017"},"content":{"rendered":"

IEC 61709:2017 is also available as \/2 which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications. Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components \u2013 rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004. This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319. Keywords: failure rate data, reliability prediction of electric components<\/p>\n

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PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nNational foreword <\/td>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
14<\/td>\nFOREWORD <\/td>\n<\/tr>\n
16<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
17<\/td>\n1 Scope
2 Normative references
3 Terms, definitions and symbols
3.1 Terms and definitions <\/td>\n<\/tr>\n
21<\/td>\n3.2 Symbols <\/td>\n<\/tr>\n
22<\/td>\n4 Context and conditions
4.1 Failure modes and mechanisms <\/td>\n<\/tr>\n
23<\/td>\n4.2 Thermal modelling
4.3 Mission profile consideration
4.3.1 General
4.3.2 Operating and non-operating conditions <\/td>\n<\/tr>\n
24<\/td>\n4.3.3 Dormancy
4.3.4 Storage
4.4 Environmental conditions <\/td>\n<\/tr>\n
25<\/td>\nTables
Table 1 \u2013 Basic environments <\/td>\n<\/tr>\n
26<\/td>\n4.5 Components choice
Table 2 \u2013 Values of environmental parameters for basic environments <\/td>\n<\/tr>\n
27<\/td>\n4.6 Reliability growth during the deployment phase of new equipment <\/td>\n<\/tr>\n
28<\/td>\n4.7 How to use this document <\/td>\n<\/tr>\n
29<\/td>\n5 Generic reference conditions and stress models
5.1 Recommended generic reference conditions
Figures
Figure 1 \u2013 Comparison of the temperature dependence of for CMOS IC <\/td>\n<\/tr>\n
30<\/td>\n5.2 Generic stress models
5.2.1 General
Table 3 \u2013 Recommended reference conditions for environmentaland mechanical stresses <\/td>\n<\/tr>\n
31<\/td>\n5.2.2 Stress factor for voltage dependence,
5.2.3 Stress factor for current dependence,
5.2.4 Stress factor for temperature dependence, <\/td>\n<\/tr>\n
33<\/td>\n5.2.5 Environmental application factor,
5.2.6 Dependence on switching rate,
Table 4 \u2013 Environmental application factor, <\/td>\n<\/tr>\n
34<\/td>\n5.2.7 Dependence on electrical stress,
5.2.8 Other factors of influence
6 Integrated semiconductor circuits
6.1 Specific reference conditions <\/td>\n<\/tr>\n
35<\/td>\nTable 5 \u2013 Memory
Table 6 \u2013 Microprocessors and peripherals, microcontrollers and signal processors
Table 7 \u2013 Digital logic families and bus interfaces, bus driver and receiver circuits <\/td>\n<\/tr>\n
36<\/td>\n6.2 Specific stress models
6.2.1 General
Table 8 \u2013 Analog ICs
Table 9 \u2013 Application-specific ICs (ASICs) <\/td>\n<\/tr>\n
37<\/td>\n6.2.2 Voltage dependence, factor
6.2.3 Temperature dependence, factor
Table 10 \u2013 Constants for voltage dependence
Table 11 \u2013 Factor for digital CMOS-family ICs
Table 12 \u2013 Factor for bipolar analog ICs
Table 13 \u2013 Constants for temperature dependence <\/td>\n<\/tr>\n
39<\/td>\nTable 14 \u2013 Factor for ICs (without EPROM; FLASH-EPROM; OTPROM; EEPROM; EAROM)
Table 15 \u2013 Factor for EPROM; FLASH-EPROM; OTPROM; EEPROM; EAROM <\/td>\n<\/tr>\n
40<\/td>\n7 Discrete semiconductors
7.1 Specific reference conditions
Table 16 \u2013 Transistors common, low frequency
Table 17 \u2013 Transistors, microwave, (e.g. RF > 800 MHz) <\/td>\n<\/tr>\n
41<\/td>\n7.2 Specific stress models
7.2.1 General
Table 18 \u2013 Diodes
Table 19 \u2013 Power semiconductors <\/td>\n<\/tr>\n
42<\/td>\n7.2.2 Voltage dependence for transistors, factor
7.2.3 Temperature dependence, factor
Table 20 \u2013 Constants for voltage dependence of transistors
Table 21 \u2013 Factor for transistors
Table 22 \u2013 Constants for temperature dependence of discrete semiconductors <\/td>\n<\/tr>\n
43<\/td>\nTable 23 \u2013 Factor for transistors, reference and microwave diodes
Table 24 \u2013 Factor for diodes (without reference and microwave diodes) and power semiconductors <\/td>\n<\/tr>\n
44<\/td>\n8 Optoelectronic components
8.1 Specific reference conditions
Table 25 \u2013 Optoelectronic semiconductor signal receivers
Table 26 \u2013 LEDs, IREDs, laser diodes and transmitter components <\/td>\n<\/tr>\n
45<\/td>\nTable 27 \u2013 Optocouplers and light barriers
Table 28 \u2013 Passive optical components
Table 29 \u2013 Transceiver, transponder and optical sub-equipment <\/td>\n<\/tr>\n
46<\/td>\n8.2 Specific stress models
8.2.1 General
8.2.2 Voltage dependence, factor
8.2.3 Current dependence, factor
Table 30 \u2013 Constants for voltage dependence of phototransistors
Table 31 \u2013 Factor for phototransistors <\/td>\n<\/tr>\n
47<\/td>\n8.2.4 Temperature dependence, factor
Table 32 \u2013 Constants for current dependence of LEDs and IREDs
Table 33 \u2013 Factor for LEDs and IREDs
Table 34 \u2013 Constants for temperature dependence of optoelectronic components <\/td>\n<\/tr>\n
48<\/td>\nTable 35 \u2013 Factor for optical components <\/td>\n<\/tr>\n
49<\/td>\n9 Capacitors
9.1 Specific reference conditions
9.2 Specific stress model
9.2.1 General
9.2.2 Voltage dependence, factor
Table 36 \u2013 Capacitors <\/td>\n<\/tr>\n
50<\/td>\nTable 37 \u2013 Constants for voltage dependence of capacitors
Table 38 \u2013 Factor for capacitors <\/td>\n<\/tr>\n
51<\/td>\n9.2.3 Temperature dependence, factor
Table 39 \u2013 Constants for temperature dependence of capacitors <\/td>\n<\/tr>\n
52<\/td>\n10 Resistors and resistor networks
10.1 Specific reference conditions
Table 40 \u2013 Factor for capacitors <\/td>\n<\/tr>\n
53<\/td>\n10.2 Specific stress models
10.2.1 General
10.2.2 Temperature dependence, factor
Table 41 \u2013 Resistors and resistor networks
Table 42 \u2013 Constants for temperature dependence of resistors <\/td>\n<\/tr>\n
54<\/td>\n11 Inductors, transformers and coils
11.1 Reference conditions
11.2 Specific stress model
11.2.1 General
11.2.2 Temperature dependence, factor
Table 43 \u2013 Factor for resistors
Table 44 \u2013 Inductors, transformers and coils
Table 45 \u2013 Constants for temperature dependence of inductors, transformers and coils <\/td>\n<\/tr>\n
55<\/td>\n12 Microwave devices
12.1 Specific reference conditions
Table 46 \u2013 Factor for inductors, transformers and coils
Table 47 \u2013 Microwave devices <\/td>\n<\/tr>\n
56<\/td>\n12.2 Specific stress models
13 Other passive components
13.1 Specific reference conditions
13.2 Specific stress models
14 Electrical connections
14.1 Specific reference conditions
Table 48 \u2013 Other passive components <\/td>\n<\/tr>\n
57<\/td>\n14.2 Specific stress models
15 Connectors and sockets
15.1 Reference conditions
15.2 Specific stress models
16 Relays
16.1 Reference conditions
Table 49 \u2013 Electrical connections
Table 50 \u2013 Connectors and sockets <\/td>\n<\/tr>\n
58<\/td>\n16.2 Specific stress models
16.2.1 General
16.2.2 Dependence on switching rate, factor
Table 51 \u2013 Relays <\/td>\n<\/tr>\n
59<\/td>\n16.2.3 Dependence on electrical stress, factor
Figure 2 \u2013 Selection of stress regions in accordance with current and voltage-operating conditions
Table 52 \u2013 Factor for low current relays
Table 53 \u2013 Factor for general purpose relays <\/td>\n<\/tr>\n
60<\/td>\n16.2.4 Temperature dependence, factor
17 Switches and push-buttons
17.1 Specific reference conditions
Table 54 \u2013 Factor for automotive relays
Table 55 \u2013 Constants for temperature dependence of relays
Table 56 \u2013 Factor for relays <\/td>\n<\/tr>\n
61<\/td>\n17.2 Specific stress model
17.2.1 General
17.2.2 Dependence on electrical stress, factor
Figure 3 \u2013 Selection of stress regionsin accordance with current and voltage-operating conditions
Table 57 \u2013 Switches and push-buttons <\/td>\n<\/tr>\n
62<\/td>\n18 Signal and pilot lamps
18.1 Specific reference conditions
18.2 Specific stress model
18.2.1 General
Table 58 \u2013 Factor for switches and push-buttons for low electrical stress
Table 59 \u2013 Factor for switches and push-buttons for higher electrical stress
Table 60 \u2013 Signal and pilot lamps <\/td>\n<\/tr>\n
63<\/td>\n18.2.2 Voltage dependence, factor
19 Printed circuit boards (PCB)
20 Hybrid circuits
Table 61 \u2013 Factor for signal and pilot lamps <\/td>\n<\/tr>\n
64<\/td>\nAnnexes
Annex A (normative) Failure modes of components
Table A.1 \u2013 Failure modes: ICs (digital) <\/td>\n<\/tr>\n
65<\/td>\nTable A.2 \u2013 Failure modes: transistors, diodes, optocouplers
Table A.3 \u2013 Failure modes: LEDs
Table A.4 \u2013 Failure modes: laser diodes and modules
Table A.5 \u2013 Failure modes: photodiodes and receiver modules <\/td>\n<\/tr>\n
66<\/td>\nTable A.6 \u2013 Failure modes: capacitors
Table A.7 \u2013 Failure modes: resistors, inductive devices, relays <\/td>\n<\/tr>\n
67<\/td>\nAnnex B (informative) Thermal model for semiconductors
B.1 Thermal model <\/td>\n<\/tr>\n
68<\/td>\nB.2 Junction temperature calculation
Figure B.1 \u2013 Temperatures inside equipment <\/td>\n<\/tr>\n
69<\/td>\nB.3 Thermal resistance evaluation
Figure B.2 \u2013 Thermal resistance model <\/td>\n<\/tr>\n
70<\/td>\nB.4 Power dissipation of an integrated circuit P
Table B.1 \u2013 Thermal resistance as a function of package type, pin number and airflow factor
Table B.2 \u2013 Typical values of are <\/td>\n<\/tr>\n
71<\/td>\nTable B.3 \u2013 Values of and <\/td>\n<\/tr>\n
73<\/td>\nAnnex C (informative) Failure rate prediction
C.1 General
C.2 Failure rate prediction for assemblies
C.2.1 General <\/td>\n<\/tr>\n
74<\/td>\nC.2.2 Assumptions and limitations
C.2.3 Process for failure rate prediction <\/td>\n<\/tr>\n
75<\/td>\nC.2.4 Prediction models <\/td>\n<\/tr>\n
76<\/td>\nC.2.5 Other methods of reliability prediction <\/td>\n<\/tr>\n
77<\/td>\nC.2.6 Validity considerations of reliability models and predictions <\/td>\n<\/tr>\n
78<\/td>\nC.3 Component considerations
C.3.1 Component model
C.3.2 Components classification
C.4 General consideration about failure rate
C.4.1 General <\/td>\n<\/tr>\n
79<\/td>\nC.4.2 General behaviour of the failure rate of components <\/td>\n<\/tr>\n
80<\/td>\nC.4.3 Expected values of failure rate
C.4.4 Sources of variation in failure rates <\/td>\n<\/tr>\n
82<\/td>\nAnnex D (informative) Considerations on mission profile
D.1 General
D.2 Dormancy <\/td>\n<\/tr>\n
83<\/td>\nD.3 Mission profile <\/td>\n<\/tr>\n
84<\/td>\nD.4 Example of mission profile
Figure D.1 \u2013 Mission profile <\/td>\n<\/tr>\n
85<\/td>\nAnnex E (informative) Useful life models
E.1 General
E.2 Power transistors
E.3 Optocouplers
E.3.1 Useful life L <\/td>\n<\/tr>\n
86<\/td>\nE.3.2 Factor L0
E.3.3 Factor (0 <\/td>\n<\/tr>\n
88<\/td>\nE.4 LED and LED modules
E.4.1 Useful life L
E.4.2 Factor L0 <\/td>\n<\/tr>\n
89<\/td>\nE.4.3 Factor (0 <\/td>\n<\/tr>\n
90<\/td>\nE.5 Aluminium, non-solid electrolyte capacitors <\/td>\n<\/tr>\n
91<\/td>\nE.6 Relays
E.7 Switches and keyboards
E.8 Connectors
Table E.1 \u2013 Useful life limitations for switches and keyboards <\/td>\n<\/tr>\n
92<\/td>\nAnnex F (informative) Physics of failure
F.1 General <\/td>\n<\/tr>\n
93<\/td>\nF.2 Failure mechanisms of integrated circuits
Table F.1 \u2013 Failure mechanism for Integrated circuits <\/td>\n<\/tr>\n
94<\/td>\nAnnex G (informative) Considerations for the design of a data base on failure rates
G.1 General
G.2 Data collection acquisition \u2013 collection process
G.3 Which data to collect and how to collect it <\/td>\n<\/tr>\n
95<\/td>\nG.4 Calculation and decision making
G.5 Data descriptions
G.6 Identification of components
G.6.1 General <\/td>\n<\/tr>\n
96<\/td>\nG.6.2 Component identification
G.6.3 Component technology
G.7 Specification of components
G.7.1 General
G.7.2 Electrical specification of components <\/td>\n<\/tr>\n
97<\/td>\nG.7.3 Environmental specification of components
G.8 Field related issues data
G.8.1 General
G.8.2 Actual field conditions
G.8.3 Data on field failures <\/td>\n<\/tr>\n
98<\/td>\nG.9 Test related issues data
G.9.1 General
G.9.2 Actual test conditions
G.9.3 Data on test failures <\/td>\n<\/tr>\n
99<\/td>\nG.10 Failure rate database attributes <\/td>\n<\/tr>\n
100<\/td>\nTable G.1 \u2013 Reliability prediction database attributes <\/td>\n<\/tr>\n
101<\/td>\nAnnex H (informative) Potential sources of failure rate data and methods of selection
H.1 General
H.2 Data source selection <\/td>\n<\/tr>\n
102<\/td>\nH.3 User data
H.4 Manufacturer\u2019s data <\/td>\n<\/tr>\n
103<\/td>\nH.5 Handbook reliability data
H.5.1 General
H.5.2 Using handbook data with this document <\/td>\n<\/tr>\n
104<\/td>\nH.5.3 List of available handbooks
Table H.1 \u2013 Result of calculation for transistors common, low frequency
Table H.2 \u2013 Sources of reliability data (in alphabetical order) <\/td>\n<\/tr>\n
107<\/td>\nAnnex I (informative) Overview of component classification
I.1 General
I.2 The IEC 61360 system <\/td>\n<\/tr>\n
108<\/td>\nTable I.1 \u2013 Classification tree (IEC\u00a061360-4) <\/td>\n<\/tr>\n
115<\/td>\nI.3 Other systems
I.3.1 General
I.3.2 NATO stock numbers
I.3.3 UNSPSC codes
I.3.4 STEP\/EXPRESS
I.3.5 IECQ <\/td>\n<\/tr>\n
116<\/td>\nI.3.6 ECALS
I.3.7 ISO 13584
I.3.8 MIL specifications <\/td>\n<\/tr>\n
117<\/td>\nAnnex J (informative) Presentation of component reliability data
J.1 General
J.2 Identification of components
J.2.1 General <\/td>\n<\/tr>\n
118<\/td>\nJ.2.2 Component identification
J.2.3 Component technology
J.3 Specification of components
J.3.1 General
J.3.2 Electrical specification of components
J.3.3 Environmental specification of components
J.4 Test related issues data
J.4.1 General <\/td>\n<\/tr>\n
119<\/td>\nJ.4.2 Actual test conditions
J.5 Data on test failures <\/td>\n<\/tr>\n
121<\/td>\nAnnex K (informative) Examples
K.1 Integrated circuit
K.2 Transistor
K.3 Capacitor <\/td>\n<\/tr>\n
122<\/td>\nK.4 Relay <\/td>\n<\/tr>\n
123<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Electric components. Reliability. Reference conditions for failure rates and stress models for conversion<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2017<\/td>\n126<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":344036,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-344030","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/344030","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/344036"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=344030"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=344030"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=344030"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}