{"id":236290,"date":"2024-10-19T15:25:15","date_gmt":"2024-10-19T15:25:15","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-60352-82011\/"},"modified":"2024-10-25T10:02:08","modified_gmt":"2024-10-25T10:02:08","slug":"bs-en-60352-82011","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-60352-82011\/","title":{"rendered":"BS EN 60352-8:2011"},"content":{"rendered":"
This part of IEC 60352 is applicable to compression mount connections with metallic spring contacts for use in telecommunication equipments and in other electronic devices employing similar techniques.<\/p>\n
Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions.<\/p>\n
The object of this part of IEC 60352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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6<\/td>\n | English \n CONTENTS <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 1 Scope and object 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 4 Requirements 4.1 General 4.2 Mounting tools 4.3 Compression mount contact <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 4.4 Connector body 4.5 Printed wiring board 4.6 Stiffener 5 Tests 5.1 General <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 5.2 Test and measuring methods <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | Tables \n Table 1 \u2013 Vibration, preferred test severities <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Figure 1 \u2013 Wiring arrangement for contact resistance test <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 5.3 Test schedule <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Table 2 \u2013 Group P \u2013 basic test <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Table 3 \u2013 Group A \u2013 corrosion test Table 4 \u2013 Group B \u2013 mechanical test <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Table 5 \u2013 Group C \u2013 climatic test Table 6 \u2013 Group D \u2013 current carrying capacity test <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 6 Practical guidance 6.1 Advantages for compression mount connection Figure 2 – An example of compression mount connection within a connector <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 6.2 Current-carrying capacity 6.3 Compression mount contact 6.4 Connector housing and printed wiring board <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Solderless connections – Compression mount connections. General requirements, test methods and practical guidance<\/b><\/p>\n |