IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition: a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 Socket code 4.1 Construction of socket code <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 4.2 Symbols 4.2.1 Semiconductor sockets symbol 4.2.2 Socket type symbol 4.2.3 Socket nominal dimension symbol 4.2.4 Number of terminal arrays 4.2.5 Terminal pitch 5 Terminal number <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 6 Socket nominal dimension 7 Socket length and width 8 Reference symbols and schematics 8.1 Outline drawings Tables Table 1 \u2013 Overview of the different socket groups <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | Figures Figure 1 \u2013 Outline drawings of the socket <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | Figure 2 \u2013 Outline drawings for the definition of terminal diameter Figure 3 \u2013 Applicable package outline <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 8.2 Reference symbols and schematics of recommended socket mounting pattern on printed circuit board Figure 4 \u2013 Socket mounting pattern <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 8.3 Overall dimensions Table 2 \u2013 Overall dimensions (1 of 2) <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | Table 3 \u2013 Socket dimensions for Group 1, 2 and 3 (square socket) (1 of 2) <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | Table 4 \u2013 Socket dimension for Group 4 (square or rectangular socket) <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | 8.4 Recommended dimensions of socket mounting pattern on printed circuit board Table 5 \u2013 Socket mounting dimensions <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | 9 Individual outline drawing standard registration Table 6 \u2013 Registration table <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Mechanical standardization of semiconductor devices – Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)<\/b><\/p>\n |