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BSI PD IEC/TS 62647-22:2013

BSI PD IEC/TS 62647-22:2013

$215.11

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Technical guidelines

Published By Publication Date Number of Pages
BSI 2013 74
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This part of IEC 62647 is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as ADHP) both during and after the transition to Pb-free electronics.

The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC/TS 62647-1:2012.

This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems. The lessons learned give specific references to solder alloys and other materials, and their expected applicability to various operating environmental conditions. The lessons learned are intended for guidance only; they are not guarantees of success in any given application.

This document may be used by other high-performance and high-reliability industries, at their discretion.

PDF Catalog

PDF Pages PDF Title
4 CONTENTS
7 FOREWORD
9 INTRODUCTION
11 1 Scope
2 Normative references
12 3 Terms, definitions and abbreviations
3.1 Terms and definitions
17 3.2 Abbreviations
18 4 Approach
4.1 General
4.2 Assumption
19 5 General Pb-free solder alloy behavior
5.1 General
5.2 Elevated temperature
20 5.3 Low temperatures
22 5.4 Temperature cycling
5.4.1 General
23 5.4.2 Solder thermal cycling failure mode
5.4.3 Stress relaxation considerations
5.4.4 Ramp rate
5.4.5 Dwell time at elevated temperature
24 5.4.6 Dwell time at low temperature
5.5 Rapid mechanical loading (vibration/shock)
6 System level service environment
6.1 General
25 6.2 Service environment
6.3 Electronics/electrical equipment thermal environments
6.3.1 General
6.3.2 Electronics/electrical equipment steady temperatures
6.3.3 Electronics/electrical equipment temperature cycling
6.4 Vibration and shock
26 6.5 Humidity
6.6 Other environments: salt spray, fungus, cooling air quality, and fluid compatibility
6.7 Other special requirements
7 High performance electronics testing
27 8 Solder joint reliability considerations
8.1 General
8.1.1 Overview
8.1.2 Final solder joint composition
8.1.3 Solder wetting and final joint shape
28 8.1.4 Strength of the PCB/PWB and component interfaces
8.2 Mixing of solder alloys and finishes
8.3 Pb-free terminations in tin-lead joints
8.3.1 General
29 8.3.2 Ball grid array Pb-free terminations in tin-lead joints
31 8.3.3 Flat pack and chip device Pb-free terminations in tin-lead joints
32 8.4 Tin-lead terminations in Pb-free joints
8.4.1 General
8.4.2 Ball grid array tin-lead terminations in lead-free joints
8.4.3 Flat pack and chip device tin-lead terminations in lead-free joints
8.5 Bismuth effects
33 8.6 JCAA/JG-PP testing of mixed alloy combinations
8.6.1 General
8.6.2 Vibration
34 8.6.3 Thermal shock testing
8.6.4 Combined environments
8.7 Pb-free solder and mixed metallurgy modeling
35 Tables
Table 1 – Review of piece part surface finish and potential concerns
36 Table 2 – Elements promoting and supressing tin whiskers
37 Table 3 – Elements promoting and supressing tin pest
38 9 Piece parts
9.1 Materials
9.2 Temperature rating
9.3 Special considerations
9.4 Plastic encapsulated microcircuit (PEM) moisture sensitivity level (MSL)
9.5 Terminal finish
39 Table 4 – Piece part lead/terminal and BGA ball metallization tin whisker and tin pest propensity
40 9.6 Assembly stresses
9.7 Hot solder dipping
10 Printed circuit boards
10.1 General
10.2 Plated through holes
41 10.3 Copper dissolution
42 10.4 PCB/PWB laminate materials
10.4.1 General
10.4.2 Coefficient of thermal expansion
43 10.5 Surface finish
44 10.6 Pb-free PCB/PWB qualification
10.7 PCB/PWB artwork and design considerations for Pb-free solder applications
Table 5 – PCB/PWB metallization tin whisker and tin pest propensity
45 11 Printed circuit board (PCB)/printed wiring board (PWB) assembly
11.1 General
11.2 PCB/PWB process indicator coupons
11.3 Solder inspection criterion
11.4 Fluxes, residues, cleaning and SIR issues
46 Table 6 – Piece part terminal and BGA ball metallization solder process compatibility risk
48 Table 7 – PCB/PWB finish solder process compatibility risk
49 Table 8 – Piece part terminal and BGA ball metallization reliability risk
50 Table 9 – PCB/PWB metallization reliability risk
51 12 Module assembly considerations
12.1 Connectors and sockets
12.2 Heatsinks/modules
12.3 Conformal coating
52 13 Manufacturing resources
14 Aerospace wiring/cabling considerations
14.1 Insulation temperature rating
14.2 Cable connectors
Table 10 – Relative rigidity of IPC-CC-830 conformal coating categories
53 14.3 Wire terminals
14.4 Splices
14.5 Sleeving
15 Rework/repair
15.1 General
55 15.2 Piece part rework
15.2.1 Area array rework
15.2.2 Surface mount capacitor/resistor rework
15.2.3 Through hole piece part rework
56 15.3 Depot level repair
15.4 Mixed solder rework temperature profiles
15.5 Solder fluxes
57 15.6 Rework/repair cleaning process
15.7 Inspection requirements
16 Generic life testing
16.1 Thermal cycling, vibration, and shock testing
Table 11 – Process temperatures of mixed alloys
58 16.2 Other environments
16.2.1 Salt fog
16.2.2 Cooling air quality
16.2.3 Fluid compatibility
16.2.4 Generic humidity
17 Similarity analysis
60 Annex A (informative) Equipment service environmental definition
A.1 Steady temperature service environments
A.2 Service cyclic temperature environments
61 Bibliography

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BSI PD IEC/TS 62647-22:2013
$215.11