BSI PD IEC/TS 61189-3-301:2016
$102.76
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB
Published By | Publication Date | Number of Pages |
BSI | 2016 | 20 |
This part of IEC 61189 outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.