BSI DD IEC/PAS 62647-3:2011
$167.15
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Performance testing for systems containing lead-free solder and finishes
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 46 |
IEC/PAS 62647-3:2011(E) addresses the evaluation of failure mechanisms, thru performance testing, expected in electronic products containing lead-free (Pb-free) solder.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | CONTENTS |
| 6 | FOREWORD |
| 8 | INTRODUCTION |
| 10 | 1 Scope |
| 11 | 2 Normative references |
| 12 | 3 Terms and definitions |
| 13 | 4 Default Test Methods 4.1 Test Vehicles |
| 14 | 4.2 Pre-Conditioning by Thermal Aging Method |
| 15 | 4.3 Default Temperature Cycle Test Method |
| 17 | 4.4 Vibration Test 4.5 Mechanical Shock |
| 18 | 4.6 Combined Environments 5 Protocol to Design and Conduct Performance Tests 5.1 Test Vehicles 5.2 Temperature Cycle Test Protocol |
| 20 | Figure 1 – Notional method for determining the recovery time for a given solder alloy, or combination of alloys. |
| 21 | Figure 2 – Notional method for determining the relationship between high temperature dwell time, thd, and recovery time, tr. (This example assumes an idealized system but the slope may differ depending on material, temperature range, and dwell.) |
| 22 | 5.3 Vibration Test Figure 3 – Notional method for determining the relationship between cycles to failure |
| 23 | 5.4 Mechanical Shock 5.5 Combined Environments Test Protocol |
| 26 | 5.6 Failure Determination and Analysis 6 Final Remarks |
| 27 | Annex A (informative) Test Sample Size |
| 29 | Annex B (informative) Material Properties of Lead-free (Pb-free) Solder Materials Table B.1 – Test and Acceleration Model Parameters |
| 32 | Annex C (informative) NASA-DoD Lead-free (Pb-free) Electronics Project Test Information(from the NASA-DoD Lead-free (Pb-free) Project Joint Test Protocol,19 September 2007) |
| 33 | Figure C.1 – Vibration Spectrum |
| 34 | Table C.1 – Vibration Profile |
| 35 | Figure C.2 – Vibration Test Fixture (from JCAA/JGPP Lead-free (Pb-free) Solder Project Team*) Table C.2 – Vibration Test Methodology |
| 36 | Figure C.3 – Vibration Table showing Y-axis (from JCAA/JGPP Lead-free (Pb-free) Solder Project Team) |
| 37 | Figure C.4 – Mechanical Shock Response Spectrum |
| 39 | Figure C.5 – Mechanical Shock Test Set-Up (from JCAA/JGPP Lead-free (Pb-free) Solder Project Team) Table C.3 – Mechanical Shock Test Methodology – Test Procedure |
| 41 | Table C.4 – Combined Environments Test Methodology |
