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BSI 23/30480992 DC 2023

BSI 23/30480992 DC 2023

$13.70

BS EN IEC 60068-2-83. Environmental testing – Part 2-83. Tests. Test Tf. Solderability testing of electronic omponents for surface mounting devices (SMD) by the wetting balance method using solder paste

Published By Publication Date Number of Pages
BSI 2023 37
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PDF Catalog

PDF Pages PDF Title
1 30480992-NC.pdf
3 91_1910e_CD.pdf
7 FOREWORD
9 1 Scope
2 Normative references
3 Terms and definitions
10 4 Test
4.1 General description
4.2 Test methods
5 Preconditioning
6 Preparation
6.1 Solder paste
11 6.2 Test jig plate
6.3 Specimen holder
7 Quick heating method
7.1 Equipment
12 7.2 Test jig plate
13 7.3 Preparation
7.4 Test condition
7.4.1 Test temperature
14 7.4.2 Feed of solder paste and immersion condition
15 7.4.3 Immersion and withdrawal conditions for test specimen
7.5 Test procedure
16 7.6 Presentation of the result
17 7.7 Characterisation parameter examples
8 Synchronous method
8.1 Equipment
18 8.2 Test jig plate
8.3 Synchronous fixture
8.4 Preparation
8.5 Test condition
8.5.1 Test temperature
8.5.2 Feed of solder paste and immersion condition
8.5.3 Immersion and withdrawal conditions for the test specimen
8.6 Test procedure
19 8.7 Presentation of the results
20 8.8 Characterisation parameter examples
9 Temperature profile method
9.1 Equipment
9.2 Test jig plate
21 9.3 Preparation
9.4 Test condition
9.4.1 Test temperature
22 9.4.2 Feed of solder paste and immersion condition
9.4.3 Immersion and withdrawal conditions for test specimen
9.5 Test procedure
23 9.6 Presentation of the result
24 9.7 Characterisation parameter examples
25 Annex A (normative) Equipment for the quick heating and synchronous method
A.1 General
A.2 Test equipment
A.2.1 General
A.2.2 Measuring system
A.2.3 Heating system
A.2.4 Lift system
26 Annex B (informative) Reading of the output data and correction of the result in the quick heating test
B.1 General
B.2 Reading of the output form in the quick heating test
27 B.3 Correction to the typical data attained by the quick heating method
29 Annex C (normative) Test equipment for the temperature profile method
C.1 General
C.2 Test equipment
C.2.1 General
C.2.2 Measuring system
C.2.3 Heating system
C.2.4 Lift system
30 Annex D (informative) Reading of the output data and correction of the result in the temperature profile test
D.1 General
D.2 Reading of the output form in the temperature profile test
31 D.3 Correction to the typical data attained by the temperature profile method
33 Annex E (informative) Caveats / Notes
E.1 General
E.2 Influences
E.2.1 Solder paste
E.2.2 Components
34 E.3 Interpreting results – Examples
E.3.1 Quick heating method
35 E.3.2 Synchronous method
36 E.3.3 Temperature profile method
37 Bibliography

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BSI 23/30480992 DC 2023
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