BS IEC 62047-43:2024
$102.76
Semiconductor devices. Micro-electromechanical devices – Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
| Published By | Publication Date | Number of Pages |
| BSI | 2024 | 22 |
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | CONTENTS |
| 5 | FOREWORD |
| 7 | INTRODUCTION |
| 8 | 1 Scope 2 Normative references 3 Terms and definitions |
| 9 | 4 Test piece 4.1 General 4.2 Shape of a test piece Figures Figure 1 – Schematic explanation of cyclic bending test |
| 10 | Figure 2 – Schematic illustration of flexible MEMS test piece |
| 11 | 5 Test method 5.1 Principle Figure 3 – Selection of bending axis |
| 12 | 5.2 Test apparatus and instrumentation 5.2.1 Test apparatus 5.2.2 Instrumentation Figure 4 – Folding procedures |
| 13 | 5.3 Procedure 5.3.1 Testing conditions 5.3.2 Selection of bending direction |
| 14 | 5.3.3 Determination of bending axes 5.3.4 Measurement of test piece dimensions 5.3.5 Measurement of folding distance 5.3.6 Number of testing |
| 15 | 5.3.7 Instrumentation 5.3.8 End of testing 6 Test report 6.1 General 6.2 Bending direction(s) and in-plane locations of bending axes 6.3 Dimensions of the test piece |
| 16 | 6.4 Performance degradation characteristics with the folding distance 6.5 Testing conditions Figure 5 – 3-dimensional P-S-N plot |
| 18 | Annex A (informative)Example of P-S-N plot of flexible MEMS device |
| 19 | Figure A.1 – Test piece – Printed wiring on paper substrate Figure A.2 – Test apparatus |
| 20 | Figure A.3 – 3-dimensional P-S-N plot Figure A.4 – 2-dimensional P-S-N plot |
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