BS IEC 62047-38:2021

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Semiconductor devices. Micro-electromechanical devices – Test method for adhesion strength of metal powder paste in MEMS interconnection

Published By	Publication Date	Number of Pages
BSI	2021	16

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Categories: 31.080.99 - Other semiconductor devices, BSI

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CONTENTS

FOREWORD

1 Scope
2 Normative references
3 Terms and definitions

4 Test piece
4.1 General
4.2 Shape of a test piece

4.3 Measurement of dimensions
4.4 Evaluation of adhesion strength
Figures
Figure 1 – Circularly patterned test piece for metal powder paste

5 Testing method and test apparatus
5.1 Test principle
5.2 Test apparatus
5.3 Test procedure

5.4 Test environment
6 Test report
Figure 2 – Schematic of a testing apparatus

Annex A (informative)Examples of adhesion strength measurement for metal powder paste
A.1 General
A.2 Adhesion strength measurement
Figure A.1 – Examples of measured force and contact area

Figure A.2 – Examples of maximum contact force, contact area, and adhesion strength

Bibliography

Status	Definitive
Pages	16
Publication Date	2021-07-07
ISBN	978 0 539 06751 4
Standard Number	BS IEC 62047-38:2021
Title	Semiconductor devices. Micro-electromechanical devices – Test method for adhesion strength of metal powder paste in MEMS interconnection
Identical National Standard Of	IEC 62047-38 Ed.1.0
Descriptors	Vocabulary, Electromechanical devices, Integrated circuits, Terminology, Electronic equipment and components, Semiconductor technology, Semiconductor devices
Publisher	BSI
Committee	EPL/47
ICS Codes	31.080.99 - Other semiconductor devices


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BS IEC 62047-38:2021

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