šŸ”„šŸ”„ Donā€™t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

šŸ”
BS EN IEC 62878-2-5:2019

BS EN IEC 62878-2-5:2019

$198.66

Device embedding assembly technology – Guidelines. Implementation of a 3D data format for device embedded substrate

Published By Publication Date Number of Pages
BSI 2019 58
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Category:

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. Weā€™re here to assist you 24/7.
Email:[email protected]

This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.

This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.

This part of IEC 62878 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 CONTENTS
8 FOREWORD
10 1 Scope
2 Normative references
3 Terms and definitions
13 4 Data definition
4.1 Flow chart design of device embedded substrate
14 4.2 Applicable range
4.2.1 Product
Figures
Figure 1 ā€“ Flow chart of design of device embedded substrate
15 4.2.2 Process
Figure 2 ā€“ General structure of device embedded substrate
16 4.3 Features
4.3.1 General
4.3.2 Device embedded substrate structure
Tables
Table 1 ā€“ Required information
17 4.3.3 SiP interposer structure
Figure 3 ā€“ Example of device embedded substrate structure
Figure 4 ā€“ Examples of SiPs
18 4.3.4 Virtual layer description
4.3.5 Terminal structure and embedded device structure including an SiP
4.3.6 Total design data of an SiP and device embedded substrate
Figure 5 ā€“ Example of virtual layer description
Figure 6 ā€“ Terminal structure
19 4.4 Data description summary
4.4.1 Type of data and structures
Figure 7 ā€“ Structure of SiP on a device embedded substrate
20 Table 2 ā€“ List of data
21 4.4.2 File structure
Figure 8 ā€“ Data structure
22 4.5 3D expression
4.5.1 General
4.5.2 Coordinates
Figure 9 ā€“ One file structure (recommended)
Figure 10 ā€“ Two file structure
23 4.5.3 Position description
4.5.4 Relation between coordinate origin and board position
Figure 11 ā€“ Definition of coordinates
Figure 12 ā€“ Position definition
24 4.6 Layer concept
4.7 Substrate data
4.7.1 General
Figure 13 ā€“ Relation between coordinates and board position
Figure 14 ā€“ Layer concept
25 4.7.2 Layer map information
Figure 15 ā€“ Layer construction
26 4.7.3 Device arrangement information
Figure 16 ā€“ Simplified layer construction
27 Figure 17 ā€“ Layer definition of pad connection
Figure 18 ā€“ Layer definition of via connection
28 4.7.4 Basic figures
Figure 19 ā€“ Rotation direction on X, Y, and Z axes
29 Figure 20 ā€“ Point
30 Figure 21 ā€“ Area
Figure 22 ā€“ Lines
31 Figure 23 ā€“ Letters
Figure 24 ā€“ Letter shape
32 Figure 25 ā€“ Bonding wire information
Figure 26 ā€“ Semi-sphere
33 Figure 27 ā€“ Truncated pyramid
Figure 28 ā€“ Via
34 4.7.5 Net information
Figure 29 ā€“ Device definition
Figure 30 ā€“ Group
35 4.7.6 Artwork information
4.7.7 Package information
Figure 31 ā€“ Data structure of net information
36 4.7.8 External port information
4.7.9 Internal port information
4.7.10 User expansion information
4.8 Defined data
4.8.1 General
4.8.2 Layer definition
37 4.8.3 Land definition
Figure 32 ā€“ Relation of layer definition data
38 4.8.4 Via definition
Figure 33 ā€“ Land definition
39 4.8.5 Device definition
Figure 34 ā€“ Relation between hole information and land information
40 4.8.6 User expansion definition
Figure 35 ā€“ Device with internal connection information
Figure 36 ā€“ Device without internal connection information
41 5 Data organization and data description based on XML schema
5.1 General
5.2 Data organization of Example 1
Figure 37 ā€“ Cross sectional view of Example 1
Figure 38 ā€“ Data organization of Example 1
42 5.3 Data description of layer stack-up
Figure 39 ā€“ Data descripion of Example 1
43 Figure 40 ā€“ Layer structure of Example 1
45 Figure 41 ā€“ Data description of layer stack-up
46 5.4 Data description of device
Figure 42 ā€“ Configuration of device 1
47 Figure 43 ā€“ Data description of device 1
48 Figure 44 ā€“ Configuration of device 2
49 Figure 45 ā€“ Data description of device 2
50 5.5 Data organization of layer
51 Figure 46 ā€“ Layer view of Example 1
53 5.6 Data description of via
Figure 47 ā€“ Data description of layers
54 5.7 Data description of land
Figure 48 ā€“ Type of vias
Figure 49 ā€“ Data description of vias
55 Figure 50 ā€“ Type of lands
Figure 51 ā€“ Data description of lands
56 Bibliography

Related products

BS EN IEC 62878-2-5:2019
$198.66