BS EN 62047-25:2016
$142.49
Semiconductor devices. Micro-electromechanical devices – Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
| Published By | Publication Date | Number of Pages |
| BSI | 2016 | 28 |
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 8 | FOREWORD |
| 10 | 1 Scope 2 Normative references 3 Terms and definitions |
| 11 | 4 Requirements 4.1 Testing structure design requirements Figures Figure 1 – Pull-press testing structure |
| 12 | Figure 2 – Shearing testing structure |
| 13 | 4.2 Testing structure fabrication requirements 4.3 Testing environment requirements 5 Testing method 5.1 General 5.2 Pull-press testing method 5.2.1 Imposing the loading force 5.2.2 Pull-press testing method operation process |
| 14 | 5.2.3 Pull-press testing method result process 5.3 Shearing testing method 5.3.1 Shearing testing method operation process Figure 3 – Pull-press testing method operation process |
| 15 | Figure 4 – Shearing testing method operation process |
| 16 | 5.3.2 Shearing testing method result process Tables Table 1 – Dimensions for shearing testing structure |
| 17 | Annex A (informative) Dimensions for testing structure and tensile/compressive strength A.1 Dimensions for testing structure A.2 Tensile strength and compressive strength Table A.1 – Dimensions for testing structure Table A.2 – Tensile strength and compressive strength (bonding area: 10 µm x 10 µm) |
| 18 | Table A.3 – Tensile strength and compressive strength (bonding area: 20 µm x 20 µm) Table A.4 – Tensile strength and compressive strength (bonding area: 30 µm x 30 µm) |
| 19 | Table A.5 – Tensile strength and compressive strength (bonding area: 40 µm x 40 µm) Table A.6 – Tensile strength and compressive strength (bonding area: 50 µm x 50 µm) Table A.7 – Tensile strength and compressive strength (bonding area: 60 µm x 60 µm) |
| 20 | Table A.8 – Tensile strength and compressive strength (bonding area: 70 µm x 70 µm) Table A.9 – Tensile strength and compressive strength (bonding area: 80 µm x 80 µm) |
| 21 | Table A.10 – Tensile strength and compressive strength (bonding area: 90 µm x 90 µm) Table A.11 – Tensile strength and compressive strength(bonding area: 100 µm x 100 µm) |
| 22 | Table A.12 – Tensile strength and compressive strength(bonding area: 110 µm x 110 µm) Table A.13 – Tensile strength and compressive strength(bonding area: 120 µm x 120 µm) |
| 23 | Table A.14 – Tensile strength and compressive strength(bonding area: 130 µm x 130 µm) Table A.15 – Tensile strength and compressive strength(bonding area: 140 µm x 140 µm) |
| 24 | Table A.16 – Tensile strength and compressive strength(bonding area: 150 µm x 150 µm) |
| 25 | Annex B (informative) Pull-press testing method example B.1 Dimensions for testing structure B.2 Tensile strength and compressive strength Table B.1 – Dimensions for testing structure Table B.2 – Tensile strength and compressive strength (bonding area: 110 µm x 110 µm) |
