BS EN 60191-6-16:2007
$86.31
Mechanical standardization of semiconductor devices – Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Published By | Publication Date | Number of Pages |
BSI | 2007 | 14 |
If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]
IEC 60191-6-16:2007 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
Status | Revision Underway |
---|---|
Pages | 14 |
Publication Date | 2007-07-31 |
ISBN | 978 0 580 55248 9 |
Standard Number | BS EN 60191-6-16:2007 |
Title | Mechanical standardization of semiconductor devices – Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
Identical National Standard Of | EN 60191-6-16:2007, IEC 60191-6-16:2007 |
Descriptors | Semiconductor devices, Electronic equipment and components, Printed-circuit boards, Standardization, Terminology, Dimensions, Test methods, Drawings, Vocabulary, Engineering drawings, Integrated circuits, Electric connectors |
Publisher | BSI |
Committee | EPL/47 |
ICS Codes | 31.180 - Printed circuits and boards |
Related products
-
BS EN 60191-4:2000:2003 Edition
Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines…
-
BS EN 60191-6-10:2003:2004 Edition
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-13:2007:2008 Edition
Mechanical standardization of semiconductor devices – Design guideline of open-top-type sockets for fine-pitch ball grid…
-
BS EN 60191-6-13:2016
Mechanical standardization of semiconductor devices – Design guideline of open-top-type sockets for Fine-pitch Ball Grid…
-
BS EN 60691:2003+A2:2010
Thermal-links. Requirements and application guide Published By Publication Date Number of Pages BSI 2010 44
-
BS EN 61191-2:2017
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publication…
-
BS EN 61191-2:2017:2019 Edition
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publication…
-
BS EN 60191-6:2009:2010 Edition
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-3:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60027-1:2006+A2:2007:2009 Edition
Letter symbols to be used in electrical technology – General Published By Publication Date Number…
-
BS EN 61191-2:2017:2019 Edition
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publication…
-
BS EN 61190-1-2:2007
Attachment materials for electronic assembly – Requirements for soldering pastes for high-quality interconnects in electronics…
-
BS EN 60191-6-20:2010
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-6:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60191-6-12:2011
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 61191-2:2017:2019 Edition
Printed board assemblies – Sectional specification. Requirements for surface mount soldered assemblies Published By Publication…
-
BS EN 60191-6-2:2002:2003 Edition
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60191-4:2014+A1:2018
Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines…
-
BS EN 60191-6:2004:2005 Edition
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 61400-25-4:2017
Wind energy generation systems – Communications for monitoring and control of wind power plants. Mapping…
-
BS EN 60191-3:2000
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-5:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS 3934-6:1992
Mechanical standardization of semiconductor devices – Specification for the preparation of outline drawings of surface…
-
BS EN 60192:2001
Low pressure sodium vapour lamps. Performance specification Published By Publication Date Number of Pages BSI…
-
BS EN 60691:2016
Thermal-links. Requirements and application guide Published By Publication Date Number of Pages BSI 2016 50
-
BS IEC 60191-1:2007
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-21:2010
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-4:2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60691:1996:2003 Edition
Thermal links. Requirements and application guide Published By Publication Date Number of Pages BSI 2003…
-
BS EN IEC 60191-1:2018
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 61249-4-18:2013:2014 Edition
Materials for printed boards and other interconnecting structures – Sectional specification set for prepreg materials,…
-
BS EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures – Reinforced base materials clad and unclad.…
-
BS EN 60191-4:2014+A1:2018
Mechanical standardization of semiconductor devices – Coding system and classification into forms of package outlines…
-
BS EN 61249-4-18:2013:2014 Edition
Materials for printed boards and other interconnecting structures – Sectional specification set for prepreg materials,…
-
BS EN 60191-6-20:2010
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of…
-
BS EN 60191-6-12:2002
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures – Reinforced base materials clad and unclad.…
-
BS EN 60191-6-8:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 60191-6-1:2001:2002 Edition
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface…
-
BS EN 62317-8:2006:2007 Edition
Ferrite cores. Dimensions – E-cores Published By Publication Date Number of Pages BSI 2007 18