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BS 5909:1980

BS 5909:1980

$86.31

Method for scale adhesion test for oxygen-free copper

Published By Publication Date Number of Pages
BSI 1980 6
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This International Standard specifies a procedure for the scale adhesion testing of oxygen-free high-conductivity copper.

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.

BS 5909:1980
$86.31