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BS 123200-003:2001

BS 123200-003:2001

$167.15

System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes

Published By Publication Date Number of Pages
BSI 2001 42
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This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to rigid double-sided printed boards with plated-through holes. It is applicable for rigid double-sided printed boards with plated-through holes made with the materials and surface finishes specified in clause 4.

This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components.

PDF Catalog

PDF Pages PDF Title
1 BRITISH STANDARD
2 Committees responsible for this British�Standard
3 Contents
7 1 Scope
2 Normative references
8 3 Terms and definitions
3.1 referee method
4 Capability qualifying component
4.1 General
4.2 Base materials
Table 1 Base materials
4.3 Surface finishes
9 Table 2 Metallic finishes
Table 3 Organic finishes
10 5 Range of capability approval
6 Capability test programme
6.1 General
6.2 Other metallic surface finishes
6.3 Organic surface finishes
6.4 External bonded heatsinks
11 6.5 Demonstration of impedance control
7 Additional capability
7.1 Maximum active board size
7.2 Plated-through hole diameters
7.3 Maximum aspect ratio
7.4 Minimum conductor width and spacing
7.5 Metallic conductor finishes
8 Traceability
12 Table 4 Capability approval test schedule and performance requirements — General
18 Table 5 Capability approval test schedule and performance requirements — Additional metallic conductor fi…
21 Table 6 Capability approval test schedule and performance requirements — Additional contact finishes
22 Table 7 Capability approval test schedule and performance requirements — Permanent organic finishes
24 Table 8 Capability approval test schedule and performance requirements — Bonded heatsinks
26 Annex A (normative) Test pattern for marking inks
Figure A.1 Test pattern for marking inks
27 Annex B (normative) Test pattern for solder masks
Figure B.1 Test pattern for solder masks
28 Annex C (normative) Test pattern for bonded heatsinks
Figure C.1 Test pattern for bonded heatsinks
29 Annex D (normative) Use of ANSI/IPC A-600F
Table D.1 Capability approval test schedule — General and additional metallic conductor finishes
30 Table D.2 Capability approval test schedule — Printed contacts
31 Table D.3 Capability approval test schedule — Solder resist
Table D.4 Capability approval test schedule — Flexible/flex-rigid printed boards
32 Annex E (normative) Test method for determination of characteristic impedance by Time Domain Reflectometr…
E.1 Principle
E.2 Test specimen
E.3 Apparatus
E.3.1 Pulse step generator
33 E.3.2 Sampling measurement system
E.3.3 Cables
E.3.4 Connectors
E.3.5 Probes
E.4 Procedure
E.4.1 Calibration
E.4.2 Measurement
34 E.4.2 Calculation
E.5 Test report
35 Figure E.1 Test specimen details
36 Figure E.2 Possible equipment configuration
37 Figure E.3 Schematic showing undisturbed interval — in situ method
38 Figure E.4 Incident wave voltage showing 2 × air line delay
39 Figure E.5 Schematic showing undisturbed interval
Annex F (informative) Sample handling considerations for TDR
F.1 Probe to sample interconnection
F.2 Reversed signal and ground connections
F.3 Grounding of stripline ground/power planes
40 F.4 Influence of unwanted contact with the test coupon
F.5 Variation in ambient temperature
Annex G (informative) Additional information about TDR

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BS 123200-003:2001
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