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BS 123100-003:2001

BS 123100-003:2001

$167.15

System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes

Published By Publication Date Number of Pages
BSI 2001 38
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This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to rigid single-sided and double-sided printed boards with plain holes. It is applicable for rigid single-sided and double-sided printed boards with plain holes made with the materials and surface finishes specified in clause 4.

This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components.

PDF Catalog

PDF Pages PDF Title
1 BRITISH STANDARD
2 Committees responsible for this British�Standard
3 Contents
7 1 Scope
2 Normative references
8 3 Terms and definitions
3.1 referee method
4 Capability qualifying component
4.1 General
4.2 Base materials
Table 1 Base materials
9 4.3 Surface finishes
Table 2 Metallic finishes
Table 3 Organic finishes
10 5 Range of capability approval
6 Capability test programme
6.1 General
6.2 Other metallic surface finishes
6.3 Organic surface finishes
6.4 Demonstration of impedance control
11 7 Additional capability
7.1 Maximum active board size
7.2 Minimum conductor width and spacing
7.3 Metallic conductor finishes
8 Traceability
12 Table 4 Capability approval test schedule and performance requirements — General
17 Table 5 Capability approval test schedule and performance requirements — Additional metallic conductor fi…
19 Table 6 Capability approval test schedule and performance requirements — Additional contact finishes
20 Table 7 Capability approval test schedule and performance requirements — Permanent organic finishes
22 Annex A (normative) Test pattern for marking inks
Figure A.1 Test pattern for marking inks
23 Annex B (normative) Test pattern for solder masks
Figure B.1 Test pattern for solder masks
24 Annex C (normative) Use of ANSI/IPC A-600F
Table C.1 Capability approval test schedule — General and additional metallic conductor finishes
25 Table C.2 Capability approval test schedule — Printed contacts
26 Table C.3 Capability approval test schedule — Solder resist
Table C.4 Capability approval test schedule — Flexible/flex-rigid printed boards
27 Annex D (normative) Test method for determination of characteristic impedance by Time Domain Reflectometr…
D.1 Principle
D.2 Test specimen
D.3 Apparatus
D.3.1 Pulse step generator
28 D.3.2 Sampling measurement system
D.3.3 Cables
D.3.4 Connectors
D.3.5 Probes
D.4 Procedure
D.4.1 Calibration
D.4.2 Measurement
D.4.3 Calculation
29 D.5 Test report
30 Figure D.1 Test specimen details
31 Figure D.2 Possible equipment configuration
32 Figure D.3 Schematic showing undisturbed interval — in situ method
33 Figure D.4 Incident wave voltage showing 2 × air line delay
34 Figure D.5 Schematic showing undisturbed interval
Annex E (informative) Sample handling considerations for TDR
E.1 Probe to sample interconnection
E.2 Reversed signal and ground connections
E.3 Grounding of stripline ground/power planes
35 E.4 Influence of unwanted contact with the test coupon
E.5 Variation in ambient temperature
Annex F (informative) Additional information about TDR

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BS 123100-003:2001
$167.15