{"id":452202,"date":"2024-10-20T09:23:05","date_gmt":"2024-10-20T09:23:05","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-24-30486622-dc-2024\/"},"modified":"2024-10-26T17:28:51","modified_gmt":"2024-10-26T17:28:51","slug":"bsi-24-30486622-dc-2024","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-24-30486622-dc-2024\/","title":{"rendered":"BSI 24\/30486622 DC 2024"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
1<\/td>\n | 30486622-NC.pdf <\/td>\n<\/tr>\n | ||||||
3<\/td>\n | 47F_462e_CD.pdf <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 4 Test bed of MEMS piezoelectric thin film 4.1 General 4.2 Initial measurements 4.3 Tests 4.3.1 DUT setup and environmental conditions <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 4.3.2 Test duration 4.3.3 Number of tests and number of DUTs 4.4 Final measurements 5 Environmental and dielectric withstand testing 5.1 Environmental testing 5.1.1 General <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 5.1.2 High-temperature bias test 5.1.3 High-temperature and high-humidity bias test <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 5.1.4 High-temperature storage 5.1.5 High-temperature and high-humidity storage <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" BS EN IEC 62047-49. Semiconductor devices. Micro-electromechanical devices – Part 49. Reliability test methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever<\/b><\/p>\n |