{"id":28837,"date":"2024-10-17T03:06:47","date_gmt":"2024-10-17T03:06:47","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/astm-f1893\/"},"modified":"2024-10-24T14:07:00","modified_gmt":"2024-10-24T14:07:00","slug":"astm-f1893","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/astm\/astm-f1893\/","title":{"rendered":"ASTM-F1893"},"content":{"rendered":"<\/p>\n<p id=\"s00002\">1.1 This guide defines the detailed requirements for testing semiconductor devices for short-pulse high dose-rate ionization-induced survivability and burnout failure. The test facility shall be capable of providing the necessary dose rates to perform the measurements. Typically, large flash X-ray (FXR) machines operated in the photon mode, or FXR e-beam facilities are utilized because of their high dose-rate capabilities. Electron Linear Accelerators (LINACs) may be used if the dose rate is sufficient. Two modes of test are described: ( <span class=\"italic\">1<\/span> ) A survivability test, and ( <span class=\"italic\">2<\/span> ) A burnout failure level test.<\/p>\n<p id=\"s00003\">1.2 The values stated in International System of Units (SI) are to be regarded as standard. No other units of measurement are included in this standard.<\/p>\n<p><h4>PDF Catalog<\/h4>\n<table border=\"1px\" class=\"des-table\">\n<tr>\n<th>PDF Pages<\/th>\n<th>PDF Title<\/th>\n<\/tr>\n<tr>\n<td><b>1<b><\/td>\n<td>Scope <br \/> Referenced Documents <br \/> Terminology  <\/td>\n<\/tr>\n<tr>\n<td><b>2<b><\/td>\n<td>Summary of Guide <br \/> Significance and Use <br \/> Interferences  <\/td>\n<\/tr>\n<tr>\n<td><b>3<b><\/td>\n<td>Apparatus  <\/td>\n<\/tr>\n<tr>\n<td><b>5<b><\/td>\n<td>Preparation of Apparatus <br \/> Procedure \u2013 Survivability Test  <\/td>\n<\/tr>\n<tr>\n<td><b>6<b><\/td>\n<td>Procedure \u2013 Burnout Failure Level Test <br \/> Report <br \/> Keywords  <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p><b>F1893-11 Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices<\/b><\/p>\n<table class=\"shortdes-table\" style=\"width: 100%\" border=\"0\" cellspacing=\"0\" cellpadding=\"0\">\n<tbody>\n<tr>\n<td>Published By<\/td>\n<td>Publication Date<\/td>\n<td>Number of Pages<\/td>\n<\/tr>\n<tr>\n<td><a href=\"https:\/\/pdfstandards.shop\/product-category\/publishers\/astm\/\"><b>ASTM<\/b><\/a><\/td>\n<td>2011<\/td>\n<td>7<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":28838,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[573,2637],"product_tag":[],"class_list":{"0":"post-28837","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-080-01","7":"product_cat-astm","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/28837","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/28838"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=28837"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=28837"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=28837"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}