BS EN 60191-6-21:2010
$102.76
Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
| Published By | Publication Date | Number of Pages |
| BSI | 2010 | 18 |
This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | 1 Scope 2 Normative references 3 Terms and definitions 4 Measuring methods |
| 7 | Figures Figure 1 – TSOP(1) outline drawings |
| 8 | Figure 2 – SSOP, TSOP(2) outline drawings |
| 9 | Figure 3 – Mounting height |
| 10 | Figure 4 – Stand-off Figure 5 – Body thickness A2 |
| 11 | Figure 6 – Lead widths bp and b1, lead thickness c and c1 |
| 12 | Figure 7 – Soldered portion length Lp |
| 13 | Figure 8 – TSOP(1) lead positional tolerance Figure 9 – SSOP and TSOP(2) lead positional tolerance |
| 14 | Figure 10 – Positional tolerance of terminals Figure 11 – Coplanarity |
| 15 | Figure 12 – Angle θ of flat portion of lead |
| 16 | Figure 13 – θ measuring points |
