ASTM-F638 2001

$35.75

F638-88(2001) Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)

Published By	Publication Date	Number of Pages
ASTM	2001	3

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Categories: 29.060.10 - Wires, ASTM

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Description

ASTM F638-88-Reapproved2001

Withdrawn Standard: Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)

ASTM F638

Scope

1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.

Keywords

magnesium aluminum wire; wire bonding

ICS Code

ICS Number Code 29.060.10 (Wires)

DOI: 10.1520/F0638-88R01

Additional information

Standard Title	F638-88(2001) Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)
Published Code	ASTM
Publication Date	2001
Pages Count	3
ICS Codes	29.060.10 - Wires